Questions around this news
What additional orders did the company secure?
The company announced additional orders for 15 chip-to-substrate thermo-compression bonding tools intended for advanced AI computing chips. The orders came from a major outsourced semiconductor assembly and test partner of a leading foundry and followed an earlier order. The company said it remains the sole supplier and Process of Record for these applications.
What does “Process of Record” mean in semiconductor manufacturing?
A Process of Record is the established, approved manufacturing process used to produce a particular device or component. It serves as the agreed reference for production, helping ensure that manufacturing steps and results remain consistent. Changes to a recorded process may require evaluation and approval before they are adopted.
What is thermo-compression bonding?
Thermo-compression bonding joins semiconductor components by applying heat and pressure to form an electrical and mechanical connection. It is used in advanced packaging, where chips or dies are connected to other components or substrates. The method can support dense interconnections in packages designed for demanding computing applications.
What market outlook did the company provide for thermo-compression bonding?
The company anticipates that the total addressable market for thermo-compression bonding will exceed US$1 billion by 2027, citing investment and development across the AI ecosystem. It also estimates that it is positioned to capture a 35% to 40% share of that expanded market. These are company expectations, not reported results.
What does an OSAT partner do?
An outsourced semiconductor assembly and test provider handles manufacturing stages that take place after a semiconductor wafer has been fabricated. These services can include cutting wafers into individual dies, assembling and packaging components, and testing finished devices. Semiconductor companies may use such providers rather than perform all these activities in-house.
December 22, 2025 -- ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had secured additional orders for 15 Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools for cutting-edge AI computing chips from a major OSAT partner of a leading foundry, following an earlier order win.
ASMPT continued to win orders as the sole supplier and Process of Record (POR) for the C2S TCB applications, enabling the customer’s next generation bonding for larger compound dies. Driven by advancement in artificial intelligence and high-performance computing applications, ASMPT is well-positioned to capitalise on the industry growth underpinned by its technological leadership.
"Winning these repeat orders underscores our customers’ trust in ASMPT as the technology and production partner of choice," said Robin Ng, Group CEO, ASMPT. "This confidence is built on ASMPT’s ability to deliver production-proven solutions. Furthermore, ASMPT’s unmatched TCB solutions, spanning chip-on-wafer, chip-on-substrate, and HBM applications cement ASMPT as the essential enabler of the industry’s ambitious advanced packaging roadmaps."
Driven by recent developments and investments in the AI ecosystem, ASMPT anticipates that the TCB Total Addressable Market (TAM) will surpass US$1 billion by 2027. The Group is strategically positioned to capture an estimated 35% to 40% share of this expanded market.
About ASMPT Limited
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.
For media enquiries:
Global ASMPT Press Office
ASMPT Ltd
Lim Ee Guan
Director, Corporate Communications
E-Mail: [email protected]
Global ASMPT Semiconductor Solutions Press Office
ASMPT Ltd
Jessica Ho
Semiconductor Solutions
E-Mail: [email protected]
ASMPT Limited
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At a glance
- Company
- ASMPT Limited
- Ticker
- HKEX: 0522
- Announcement
- Product
Key figures
- Additional C2S TCB tool orders
- 15
- Anticipated TCB market size by 2027
- US$1 billion
- Estimated share of expanded TCB market
- 35% to 40%
People
- Robin NgGroup CEO, ASMPT
