Fujifilm to Showcase “One-Stop Solutions” at SEMICON Japan 2025

Introducing its end-to-end product portfolio and cutting-edge technologies that address customer challenges!

Tokyo, Japan, December 9, 2025 -- FUJIFILM Corporation will participate in “SEMICON Japan 2025”, an international exhibition of semiconductor manufacturing equipment and materials, to be held at Tokyo Big Sight, Japan, from December 17 to 19, 2025.
Fujifilm introduces its broad portfolio of cutting-edge semiconductor materials as a “one-stop solution,” demonstrating its robust production and support capabilities to contribute to the further advancement of the semiconductor industry.
At SEMICON Japan 2025, Fujifilm will showcase a comprehensive lineup of semiconductor materials covering nearly the entire semiconductor manufacturing process, from cutting-edge to legacy nodes. Fujifilm will introduce new products of its world-leading image sensor color filter material WAVE CONTROL MOSAIC™*1, and introduce “ZEMATES™*2,” a new brand of photosensitive insulating film materials for back-end processes that contribute to improving semiconductor package reliability. Furthermore, Fujifilm will deliver a presentation at the SuperTHEATER session titled “Next-Generation Semiconductor Technology (Equipment and Materials)” on the opening day of SEMICON Japan, Wednesday, December 17. 

• Advanced photoresists*3
  EUV, ArF, KrF, PFAS-free*4 resists, nanoimprint*5 resists
• CMP solutions
  World-leading CMP slurries*6 including copper interconnect solutions, post-CMP cleaners*7
• Image sensor color filter materials
  WAVE CONTROL MOSAIC™, including the world's first KrF-compatible image sensor color filter material
• Advanced packaging materials
  “ZEMATES™” brand polyimides*8 and thermal interface materials (TIM)
• Co-creation development proposals utilizing “Materials Informatics” and “Generative AI”

Fujifilm will also exhibit the microfilter “AstroPore” for filtering liquids such as ultrapure water, various chemicals, and CMP slurry used in semiconductor manufacturing; the pressure measurement film “Prescale” for measuring flatness of wafer bonding surface; and solutions for quantifying pressure information: Pressure Image Analysis System “FUJIFLM Prescale Station*9” and Pressure Image Analysis App “FUJIFLM Prescale Mobile*10”.
Fujifilm operates three semiconductor material production sites in Japan (Shizuoka, Oita and Kumamoto). In addition to achieving “local production for local consumption” by manufacturing near its semiconductor device manufacturer customers, the company promotes “local support” by supporting customers in development, production, and quality control from nearby locations.
The company strengthened CMP slurry production capacity at its Kumamoto site in January 2025 and completed a new building for advanced semiconductor material development and evaluation at its Shizuoka site in November 2025. Furthermore, construction of a new building to increase post-CMP cleaner production capacity at its Oita site is scheduled for spring 2026. These initiatives strengthen its ability to meet the growing demand for semiconductors supporting the highly information-oriented society, including those for rapidly expanding AI data centers.

Fujifilm will continue its technological development and accelerate the provision of one-stop solutions that meet diverse customer needs, thereby contributing to the further advancement of the global semiconductor industry.

Overview of “SEMICON Japan 2025”

Overview of the Presentation at “Super THEATER”

• “SEMICON Japan 2025” Fujifilm Special Site
• “SEMICON Japan 2025” Official Website

• *1 General term referring to a group of functional materials for controlling electromagnetic light waves in a broad range of wavelengths, including photosensitive color materials for manufacturing color filters for image sensors such as CMOS sensors, used in digital cameras and smartphones. WAVE CONTROL MOSAIC is a registered trademark or trademark of FUJIFILM Corporation.
• *2 ZEMATES is a registered trademark or trademark of FUJIFILM Corporation.
• *3 Material used to coat wafer substrate when circuit patterns are drawn in the process of semiconductor manufacturing.
• *4 PFAS refers to a collective term for perfluoroalkyl compounds, polyfluoroalkyl compounds, and their salts, as defined in the OECD's 2021 report “Reconciling Terminology of the Universe of Per- and Polyfluoroalkyl Substances: Recommendations and Practical Guidance.” Accordingly, the claim ‘PFAS-Free’ denotes the absence of substances falling within this defined group.
• *5 Nanoimprint lithography. A technology in which a mask (mold) with circuit patterns is pressed onto the resist applied to a semiconductor wafer, like a stamp, to transfer and form the circuit patterns.
• *6 A proprietary formulation containing an abrasive that uniformly planarizes semiconductor surface, which contains a mixture of wires and insulation films of varying hardness.
• *7 Cleaners used after polishing with CMP slurry to remove particles, minute metal fragments and organic residues while protecting the metal surface.
• *8 A material with strong heat resistance and insulation properties, used for forming semiconductorsprotective films and rewiring layer.
• *9 The system that performs Prescale inspection (reading, analysis, and storage) in one-stop-solution, and quantifies pressure information on PC.
• *10 The app that enables any user to easily digitize and quantify pressure data by capturing Prescale using mobile app.

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