Questions around this news
What is an FC-BGA substrate?
An FC-BGA substrate is a high-density package component that connects a semiconductor chip to a circuit board. “Flip chip” refers to how the chip is attached, while a ball grid array uses an array of solder balls to make electrical connections. The substrate routes signals and power between the chip and the board.
What will the new manufacturing line produce, and what capabilities will it add?
The Niigata Plant line will make FC-BGA substrates, with a focus on larger, multilayer products for high-speed transmission in AI and data center semiconductors. The release says it will support new low-dielectric materials, use copper-wiring surface treatment that considers high-speed signal effects, accommodate greater substrate thickness, and strengthen inspection and foreign-particle controls.
How will the new line affect TOPPAN’s FC-BGA production capacity?
Once the new line is operating, FC-BGA production capacity at the Niigata Plant is expected to reach double the level in the first half of fiscal 2022, according to the release. TOPPAN began mass production of these substrates at the plant in 2014 and expanded production there in phases, including an expanded line that began mass production in 2022.
When does TOPPAN plan to bring the new line into production, and what is planned for Singapore?
The release says the Niigata line will come online in January 2026, with mass production targeted by the end of fiscal 2025. TOPPAN also says its Singapore Plant is under construction and is due to begin operations in late 2026. The company describes the two-plant setup as a way to support business continuity and global FC-BGA supply.
What do low dielectric constant and low dielectric dissipation factor mean for high-speed substrates?
Dielectric constant describes how a material responds to an electric field and affects how signals travel through it. Dielectric dissipation factor indicates how much signal energy the material loses as heat. In high-speed circuits, materials with low values for these properties can help reduce signal delay and loss, though performance depends on the whole design.
Bolstering high-end substrate production capabilities to meet semiconductor needs for AI and data centers
December 17, 2025 -- TOPPAN Inc. (TOPPAN), a TOPPAN Group company and wholly owned subsidiary of TOPPAN Holdings Inc. (TYO: 7911), has constructed a new manufacturing line at its Niigata Plant (Shibata, Niigata Prefecture, Japan ) for Flip Chip-Ball Grid Array (FC-BGA) substrates, a form of high-density semiconductor packaging. The new line will come online in January 2026.
Background to the Launch of the New Line
Against a backdrop of rising demand for data centers and edge computing, demand for FC-BGA substrates is increasing. TOPPAN began mass production of FC-BGA substrates at the Niigata Plant in 2014 and has since increased capacity in phases, including the launch of mass production on an expanded line in 2022. Recent years, however, have seen an acceleration in scaling of FC-BGA size, a rise in the number of layers, and increasingly advanced technical specifications, leading to continued growth in production capacity utilization.
The launch of the new manufacturing line will bolster TOPPAN’s capabilities for high-end FC-BGAs—large-scale, multilayer substrates delivering high-speed transmission needed for AI and data center semiconductors. FC-BGA production capacity at the Niigata Plant will reach double the fiscal 2022 first half level.
Features of the New Manufacturing Line
・Enhanced support for high-speed transmission
A process will be established to support new low-dielectric constant/low-dielectric dissipation factor materials. The line will employ copper wiring surface treatment that takes into account skin effects during high-speed signal transmission.
・Supporting larger, multilayer substrates
There will be a further increase in transferable substrate thickness. The line is designed to support production of sizes that are too large even for JEDEC-standard-compliant trays. Inspection processes and measures against foreign particles will also be enhanced to increase yield rate.
・Smart factory measures
Autonomous mobile robots will be adopted for transfer between certain processes.
Future Activities
TOPPAN aims to launch mass production on the new FC-BGA manufacturing line by the end of fiscal 2025. With the Singapore Plant currently under construction and due to launch operations in late 2026, a two-plant manufacturing system will enhance business continuity capabilities and facilitate global supply of FC-BGAs.
About the TOPPAN Group
Established in Tokyo in 1900, the TOPPAN Group is a leading and diversified global provider committed to delivering sustainable, integrated solutions in fields including printing, communications, security, packaging, décor materials, electronics, and digital transformation. The TOPPAN Group’s global team of more than 50,000 employees offers optimal solutions enabled by industry-leading expertise and technologies to address the diverse challenges of every business sector and society and contribute to the achievement of shared sustainability goals.
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In brief
TOPPAN Inc. has completed a new FC-BGA substrate manufacturing line at its Niigata Plant in Shibata, Japan. The company says the line is intended to expand production of large, multilayer substrates for semiconductors used in AI and data centers, where demand and technical requirements are rising. It includes processes for low-dielectric materials and high-speed signal transmission, as well as support for thicker and larger substrates, enhanced inspection and foreign-particle controls, and autonomous mobile robots for some transfers. TOPPAN says Niigata’s FC-BGA production capacity will reach double its fiscal 2022 first-half level. The line is scheduled to come online in January 2026, with mass production targeted by the end of fiscal 2025. TOPPAN also cites a Singapore plant under construction, expected to begin operations in late 2026, as part of a planned two-plant production system.
Key takeaways
- TOPPAN completed a new FC-BGA substrate line at its Niigata Plant in Japan.
- The line is designed for large, multilayer substrates used in AI and data center semiconductors.
- Niigata FC-BGA capacity is expected to reach double its fiscal 2022 first-half level.
- TOPPAN targets mass production by the end of fiscal 2025; its Singapore plant is expected to operate in late 2026.
Earlier from the TOPPAN Group
- TOPPAN to Install Pilot Line for Advanced Semiconductor Packaging at Ishikawa Plant
- TOPPAN Group Launches Business Supporting Sales of Japanese Anime and Manga Merchandise in UK
- TOPPAN Group Launches Business Supporting Sales of Japanese Anime and Manga Merchandise in UK
- TOPPAN Group Acquires Italian High-performance BOPP Film Company
- TOPPAN Holdings Named to Dow Jones Sustainability World Index for Successive Years
