ASMPT Secures Additional Orders for 15 Chip-to-Substrate Thermo-Compression Bonding Tools — AI Tailwind

ASMPT wins repeat orders for 15 C2S TCB tools from a major OSAT partner, positioning to capture significant share of a growing AI-driven market.

December 23, 2025 -- ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced it had secured additional orders for 15 Chip-to-Substrate (C2S) Thermo-Compression Bonding (TCB) tools for cutting-edge AI computing chips from a major OSAT partner of a leading foundry, following an earlier order win.

ASMPT continued to win orders as the sole supplier and Process of Record (POR) for the C2S TCB applications, enabling the customer’s next generation bonding for larger compound dies. Driven by advancement in artificial intelligence and high-performance computing applications, ASMPT is well-positioned to capitalise on the industry growth underpinned by its technological leadership.

"Winning these repeat orders underscores our customers’ trust in ASMPT as the technology and production partner of choice," said Robin Ng, Group CEO, ASMPT. “This confidence is built on ASMPT’s ability to deliver production-proven solutions. Furthermore, ASMPT’s unmatched TCB solutions, spanning chip-on-wafer, chip-on-substrate, and HBM applications cement ASMPT as the essential enabler of the industry’s ambitious advanced packaging roadmaps.”

Driven by recent developments and investments in the AI ecosystem, ASMPT anticipates that the TCB Total Addressable Market (TAM) will surpass US$1 billion by 2027. The Group is strategically positioned to capture an estimated 35% to 40% share of this expanded market.

About ASMPT Limited

ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.

ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.

For media enquiries:

Global ASMPT Press Office

ASMPT Ltd Lim Ee Guan

Director, Corporate Communications

E-Mail: [email protected]

Global ASMPT Semiconductor Solutions Press Office

ASMPT Ltd

Jessica Ho

Semiconductor Solutions

E-Mail: [email protected]

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