Questions around this news
What did ASMPT announce about its TCB AOR technology?
ASMPT said it received an order from an unnamed leading customer for two ultrafine-pitch thermo-compression bonding tools equipped with its plasma Active Oxide Removal technology. The tools are intended for chip-to-wafer applications. The company described the order as a milestone for its technology and said it plans to build on its technology and process expertise.
How does thermo-compression bonding work?
Thermo-compression bonding joins components by applying heat and pressure to bring their surfaces into contact and form a bond. The method can be used to make dense connections between semiconductor chips and other components. The process must control factors such as alignment, temperature, pressure and surface condition to create reliable connections.
What is the difference between chip-to-wafer and chip-to-substrate packaging?
In chip-to-wafer packaging, individual chips are attached to a wafer that carries multiple chip sites. In chip-to-substrate packaging, chips are bonded onto a substrate, which provides electrical connections to the wider package. Both approaches can support advanced packaging, but they differ in the receiving surface and in how assembly is organized.
What does ASMPT say about its position in HBM and advanced packaging?
The release says ASMPT had secured HBM4 12H orders from multiple HBM players and was the process of record for chip-to-substrate applications. It also describes the new chip-to-wafer order as making the company a preferred solutions provider for that application. These are statements made by the company in the announcement.
February 10, 2026 -- ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced that it had won a new order for two ultrafine pitch Thermo-Compression Bonding (TCB) tools equipped with ASMPT’s proprietary plasma Active Oxide Removal (AOR) technology from a leading customer for C2W applications. This reinforces ASMPT’s strategic position as a technologically superior and holistic semiconductor solutions provider.
"This C2W order for our TCB AOR solution is a significant milestone for ASMPT and our TCB AOR technology," said Robin Ng, Group CEO, ASMPT.
“We will build on our technology and process expertise to remain the leading solutions provider for advanced logic and memory.”
This C2W achievement underscores ASMPT’s leadership across both advanced logic and memory applications. ASMPT was the first to secure HBM4 12H orders from multiple HBM players and is the process of record for chip-to-substrate (C2S) applications. With this milestone, it is now the preferred solutions provider for C2W applications. With its range of differentiated and advanced TCB solutions, ASMPT remains well-positioned as a key enabler of the industry’s ambitious advanced packaging roadmaps.
About ASMPT Limited
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.
Global ASMPT Press Office
ASMPT Ltd
Lim Ee Guan
Director, Corporate Communications
E-Mail: [email protected]
Global ASMPT Semiconductor Solutions Press Office
ASMPT Ltd
Jessica Ho Semiconductor Solutions
E-Mail: [email protected]
ASMPT Limited
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In brief
ASMPT says it has received an order from an unnamed leading customer for two thermocompression bonding tools intended for chip-to-wafer applications. The tools use the company’s plasma-based Active Oxide Removal technology and are designed for ultrafine-pitch bonding. ASMPT described the order as a milestone for its chip-to-wafer offering. Group CEO Robin Ng said the company will draw on its technology and process expertise in advanced logic and memory. The release also says ASMPT has received HBM4 12H orders from multiple HBM players and serves as the process of record for chip-to-substrate applications. ASMPT says the new order makes it a preferred provider for chip-to-wafer applications, and presents its broader thermocompression bonding portfolio as supporting advanced packaging roadmaps.
Key takeaways
- ASMPT reports an order for two thermocompression bonding tools equipped with its plasma-based AOR technology.
- The customer is described as a leading provider, but is not named.
- ASMPT says the order marks a milestone for its chip-to-wafer offering.
- The company also cites its positions in HBM4 12H and chip-to-substrate applications.
Earlier from ASMPT Limited
- ASMPT Extends Technology Leadership With Key TCB AOR Chip-To-Wafer Milestone
- ASMPT Announces Assessment of Strategic Options for SMT Solutions Segment
- ASMPT Secures Additional Orders for 15 Chip-to-Substrate Thermo-Compression Bonding Tools — AI Tailwind
- ASMPT Secures Additional Orders for Fifteen Chip-to-Substrate Thermo-Compression Bonding Tools Driven by AI Tailwind
- ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
