At a glance
- Company
- ASMPT Limited
- Ticker
- HKEX: 0522
- Announcement
- Product
- Location
- Singapore
Key figures
- TCB tools ordered
- two
People
- Robin NgGroup CEO, ASMPT
Products and programs
February 6, 2026 -- ASMPT Extends Technology Leadership With Key TCB AOR Chip-To-Wafer Milestone
ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced that it had won a new order for two ultrafine pitch Thermo-Compression Bonding (TCB) tools equipped with ASMPT’s proprietary plasma Active Oxide Removal (AOR) technology from a leading customer for C2W applications. This reinforces ASMPT’s strategic position as a technologically superior and holistic semiconductor solutions provider.
“This C2W order for our TCB AOR solution is a significant milestone for ASMPT and our TCB AOR technology,” said Robin Ng, Group CEO, ASMPT.
“We will build on our technology and process expertise to remain the leading solutions provider for advanced logic and memory.”
This C2W achievement underscores ASMPT’s leadership across both advanced logic and memory applications. ASMPT was the first to secure HBM4 12H orders from multiple HBM players and is the process of record for chip-to-substrate (C2S) applications. With this milestone, it is now the preferred solutions provider for C2W applications. With its range of differentiated and advanced TCB solutions, ASMPT remains well-positioned as a key enabler of the industry’s ambitious advanced packaging roadmaps.
About ASMPT Limited
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.
Global ASMPT Press Office
ASMPT Ltd
Lim Ee Guan
Director, Corporate Communications
E-Mail: [email protected]
Global ASMPT Semiconductor Solutions Press Office
ASMPT Ltd
Jessica Ho Semiconductor Solutions
E-Mail: [email protected]
ASMPT Limited
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In brief
ASMPT says it has received an order from a leading customer for two ultrafine-pitch Thermo-Compression Bonding tools using its plasma Active Oxide Removal technology. The equipment is intended for chip-to-wafer applications. Group CEO Robin Ng called the order an important step for the company and its TCB AOR technology, and said ASMPT will draw on its technical and process capabilities in advanced logic and memory. The release also cites the company’s HBM4 12H orders from multiple HBM players and its role in chip-to-substrate applications. ASMPT says the new order makes it a preferred provider for chip-to-wafer applications and supports its position in advanced packaging.
Key takeaways
- ASMPT reports an order for two TCB tools featuring its plasma AOR technology.
- The customer will use the tools for chip-to-wafer applications.
- Group CEO Robin Ng described the order as a milestone for ASMPT and its TCB AOR technology.
- ASMPT says it is now a preferred solutions provider for chip-to-wafer applications.
Earlier from ASMPT Limited
- ASMPT Announces Assessment of Strategic Options for SMT Solutions Segment
- ASMPT Secures Additional Orders for 15 Chip-to-Substrate Thermo-Compression Bonding Tools — AI Tailwind
- ASMPT Secures Additional Orders for Fifteen Chip-to-Substrate Thermo-Compression Bonding Tools Driven by AI Tailwind
- ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
- ASMPT Wins New Orders for Nineteen Chip-to-Substrate TCB Tools to Serve AI Chip Market
