-- ASMPT (HKEX: 0522), the world’s leading provider of integrated hardware and software solutions for semiconductor and electronics manufacturing, announced that it had won a new order for two ultrafine pitch Thermo-Compression Bonding (TCB) tools equipped with ASMPT’s proprietary plasma Active Oxide Removal (AOR) technology from a leading customer for C2W applications. This reinforces ASMPT’s strategic position as a technologically superior and holistic semiconductor solutions provider.
"This C2W order for our TCB AOR solution is a significant milestone for ASMPT and our TCB AOR technology," said Robin Ng, Group CEO, ASMPT.
“We will build on our technology and process expertise to remain the leading solutions provider for advanced logic and memory.”
This C2W achievement underscores ASMPT’s leadership across both advanced logic and memory applications. ASMPT was the first to secure HBM4 12H orders from multiple HBM players and is the process of record for chip-to-substrate (C2S) applications. With this milestone, it is now the preferred solutions provider for C2W applications. With its range of differentiated and advanced TCB solutions, ASMPT remains well-positioned as a key enabler of the industry’s ambitious advanced packaging roadmaps.
About ASMPT Limited
ASMPT Limited is a leading global supplier of hardware and software solutions for the manufacture of semiconductors and electronics. Headquartered in Singapore, ASMPT's offerings encompass the semiconductor assembly & packaging, and SMT (surface mount technology) industries, ranging from wafer deposition to the various solutions that organise, assemble and package delicate electronic components into a vast range of end-user devices. ASMPT partners with customers very closely, with continuous investment in R&D helping to provide cost-effective, industry-shaping solutions that achieve higher productivity, greater reliability, and enhanced quality.
ASMPT is listed on the Stock Exchange of Hong Kong (HKEX stock code: 0522) and is one of the constituent stocks of the HKEX Tech 100 Index, Hang Seng Composite MidCap Index under the Hang Seng Composite Size Indexes, the Hang Seng Composite Information Technology Industry Index under Hang Seng Composite Industry Indexes, the Hang Seng Corporate Sustainability Benchmark Index, and the Hang Seng HK 35 Index. To learn more about ASMPT, please visit us at www.asmpt.com.
Global ASMPT Press Office
ASMPT Ltd
Lim Ee Guan
Director, Corporate Communications
E-Mail: eg.lim@asmpt.com
Global ASMPT Semiconductor Solutions Press Office
ASMPT Ltd
Jessica Ho Semiconductor Solutions
E-Mail: semi_stratmkt@asmpt.com
ASMPT Limited
